Siemens Simcenter FloTHERM 2304 | 953.0 mb
Languages Supported: English, 日本語, Simplified 中文
Languages Supported: English, 日本語, Simplified 中文
The Siemens Digital Industries Software development team is pleased to announce the availability of Simcenter Flotherm 2304. The following new features are available in this release: Model the Complexity – Improved interface with CAD tools with enhancements to MCAD Bridge.
Simcenter Flotherm 2304 – What’s New
Stay integrated & go faster
Faster, Easier CAD handling for CFD – MCAD Bridge Enhancements. Parasolid 3D modeling and new geometry import from Siemens NX, Solid Edge and others.
MCAD Bridge at Simcenter Flotherm 2304 now supports import from the following additional file types:
- Siemens NX
- Siemens Solid Edge
- Parasolid
- JT
- PLMXML
- XTXML
Voxelization quality and speed – a step change in performance
In terms of representing imported geometry with sufficient quality and detail, engineers can now select the number of ray directions and options for handling faceted geometry better. A higher number of ray directions helps better determine edges and facets for a more accurate voxelization solution.A step change in speed for voxelization has been delivered in Simcenter Flotherm 2304, with time saving benefits in demonstrated cases reducing this pre-processing from hours to minutes or less.
Faster pre-solve phase – up to 10x speed up for large models
Often electronics cooling simulation models will have a high volume of objects depending on the geometry or PCB complexity. For particularly complex models with over 100,000+ objects, such as a multi-layer PCB with mounted components in a detailed enclosure, this can impact pre-solve time. A new re-engineered translator phase has been introduced in Simcenter Flotherm 2304 which is optimized for the high level of complexity in such models. The table below show’s comparison of load and translation time for a variety of models with 100’000s of objects.
The powerful FloTHERM suite of 3D computational fluid dynamics (CFD) software predicts airflow and heat transfer, in and around electronic equipment. FloTHERM delivers right-by-design products that save design time and reduce the need for physical prototyping from components and boards to complete systems and data centers.
FloTHERM is the market-leading electronics cooling simulation software with more installed seats than all other electronics cooling CFD software. For over 25 years FloTHERM has supported a huge customer base, including almost all the major blue-chip electronics companies in the world. FloTHERM supports chip, package, board and system design, and even extends out to datacenters. It is designed as a vertically-specialized solution for the electronics thermal market through its innovative SmartPart technology, extensive libraries, tailored and stable solution technology, state-of-the art compact thermal modeling techniques and parametric analysis & optimization functionality. FloTHERM features advanced interfacing technologies for working with EDA data from Mentor Graphics, Cadence and Zuken and is backed by a family of ancillary solutions for PCB (FloTHERM PCB) and package modeling (FloTHERM PACK and FloTHERM IC).
Fast electronics cooling simulation
Mentor Graphics, a Siemens Business, is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products help conquer complex design challenges. Mentor is technology leader in full chip emulation, Functional Verification, Design-for-Test and physical verification with its Veloce, Questa, Tessent and Calibre platforms.
Owner: Mentor Graphics
Product Name: Simcenter FloTHERM
Version: 2304
Supported Architectures: x64
Website Home Page : www.mentor.com
Languages Supported: multilanguage
System Requirements: Windows *
Size: 953.0 mb
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